You searched for: "Semiconductor Design and Fabrication"
| Number | Title | Original Assignee |
|---|---|---|
| 8680572 | Microdisplay Packaging System | Intel Corporation |
| 8593474 | Method and System for Symmetric Allocation for a Shared L2 Mapping Cache | Intel Corporation |
| 8555091 | Dynamic power State Determination | Intel Corporation |
| 8544019 | Thread Queuing Method and Apparatus | Intel Corporation |
| 8417986 | Time Negotiation Using Serial Voltage Identification Communication | Intel Corporation |
| 8412976 | Data Negotiation Using Serial Voltage Identification Communication | Intel Corporation |
| 8386626 | Transmit Scaling Using Multiple Queues | Intel Corporation |
| 8355261 | Systems and Methods to Secure a Circuit Board | Intel Corporation |
| 8312326 | Delta Checkpoints for a Non-Volatile Memory Indirection Table | Intel Corporation |
| 8148959 | Microprocessor Die With Integrated Voltage Regulation Control Circuit | Intel Corporation |
| 8044431 | Microdisplay Packaging System | Intel Corporation |
| 8001444 | Ecc Functional Block Placement in a Multichannel Mass Storage Device | Intel Corporation |
| 7987352 | Booting With Sub Socket Partitioning | Intel Corporation |
| 7981758 | Systems and Methods to Laminate Passives Onto Substrate | Intel Corporation |
| 7979507 | Transmit Scaling Using Multiple Queues | Intel Corporation |
| 7975272 | Thread Queuing Method and Apparatus | Intel Corporation |
| 7925925 | Delta Checkpoints for a Non-Volatile Memory Indirection Table | Intel Corporation |
| 7909627 | Multi-Axis Retention Mechanism | Intel Corporation |
| 7908421 | Universal Serial Bus Endpoint Context Caching | Intel Corporation |
| 7906947 | Microprocessor Die With Integrated Voltage Regulation Control Circuit | Intel Corporation |
| 7890790 | Transactional Flow Management Interrupt Debug Architecture | Intel Corporation |
| 7882634 | Heat Sink Design Using Clad Metal | Intel Corporation |
| 7838419 | Systems and Methods to Laminate Passives Onto Substrate | Intel Corporation |
| 7836748 | Chamber Sealing Valve | Intel Corporation |
| 7790598 | System, Apparatus, and Method for Advanced Solder Bumping | Intel Corporation |
| 7781889 | Shielded Via | Intel Corporation |
| 7778881 | Transaction Entity to Facilitate Exchanges Between Remote Customers and Vendors | Everdrive LLC |
| 7750450 | Stacked Die Package With Stud Spacers | Intel Corporation |
| 7745917 | Compliant Integrated Circuit Package Substrate | Intel Corporation |
| 7719251 | Enhancement of power Conversion Efficiency Using Dynamic Load Detecting and Tracking | Intel Corporation |
| 7700945 | On-Chip Storage of Hardware Events for Debugging | Intel Corporation |
| 7695189 | System to Calibrate On-Die Temperature Sensor | Intel Corporation |
| 7692278 | Stacked-Die Packages With Silicon Vias and Surface Activated Bonding | Intel Corporation |
| 7691667 | Compliant Integrated Circuit Package Substrate | Intel Corporation |
| 7677902 | Extended Package Substrate | Intel Corporation |
| 7667320 | Integrated Circuit Package With Improved power Signal Connection | Intel Corporation |
| 7651308 | Carrier to Hold Semiconductor Device Using Opposed Rollers | Intel Corporation |
| 7620840 | Transactional Flow Management Interrupt Debug Architecture | Intel Corporation |
| 7619318 | No-Flow Underfill Copmosition and Method | Intel Corporation |
| 7589414 | I/O Architecture for Integrated Circuit Package | Intel Corporation |
| 7557036 | Method, System, and Apparatus for Filling Vias | Intel Corporation |
| 7554808 | Heat Sink With Themoelectric Module | Intel Corporation |
| 7532023 | Apparatus and Methods for Self-Heating Burn-In Process | Intel Corporation |
| 7518222 | Apparatus and System for an Ic Substrate, Socket, and Assembly | Intel Corporation |
| 7517788 | System, Apparatus, and Method for Advanced Solder Bumping | Intel Corporation |
| 7501316 | Asymmetric Memory Cell | Intel Corporation |
| 7490215 | Media Memory System and Method for Providing Concurrent Memory Access to a Plurality of Processors Through Separate Translation Table Information | Intel Corporation |
| 7489150 | Apparatus and Methods for Self-Heating Burn-In Process | Intel Corporation |
| 7471515 | Integrated Circuit Coolant Microchannel Assembly With Manifold Member That Facilitates Coolant Line Attachment | Intel Corporation |
| 7443184 | Apparatus and Methods for Self-Heating Burn-In Process | Intel Corporation |
| 7427716 | Microvia Structure and Fabrication | Intel Corporation |
| 7421673 | Design Checks for Signal Lines | Intel Corporation |
| 7421672 | Design Checks for Signal Lines | Intel Corporation |
| 7421593 | Control of Parallel-Connected Voltage Regulators for Supplying power to Integrated Circuit | Intel Corporation |
| 7421052 | Oscillator Frequency Selection | Intel Corporation |
| 7418998 | Chamber Sealing Valve | Intel Corporation |
| 7417448 | System to Calibrate On-Die Temperature Sensor | Intel Corporation |
| 7411296 | Method, System, and Apparatus for Gravity Assisted Chip Attachment | Intel Corporation |
| 7397067 | Microdisplay Packaging System | Intel Corporation |
| 7395933 | Carrier to Hold Semiconductor Device Using Opposed Rollers | Intel Corporation |
| 7380168 | System Development tool | Intel Corporation |
| 7378726 | Stacked Packages With Interconnecting Pins | Intel Corporation |
| 7378331 | Methods of Vertically Stacking Wafers Using Porous Silicon | Intel Corporation |
| 7366930 | A System and Method for Successfully Negotiating a Slowest Common Link Speed Between a First and Second Device (As Amended By Examiner) | Intel Corporation |
| 7361842 | Apparatus and Method for an Embedded Air Dielectric for a Package and a Printed Circuit Board | Intel Corporation |
| 7355246 | Memory Cell Without Halo Implant | Intel Corporation |
| 7353413 | Computer System power Policy Adjustment in Response to an Affirmative Indication From a User | Intel Corporation |
| 7348678 | Integrated Circuit Package to Provide High-Bandwidth Communication Among Multiple Dice | Intel Corporation |
| 7348214 | Integrated Circuit Package With Improved power Signal Connection | Intel Corporation |
| 7345361 | Stackable Integrated Circuit Packaging | Intel Corporation |
| 7339368 | Methods and Apparatus for Testing Circuit Boards | Intel Corporation |
| 7330357 | Integrated Circuit Die/Package Interconnect | Intel Corporation |
| 7329946 | I/O Architecture for Integrated Circuit Package | Intel Corporation |
| 7317615 | Integrated Circuit Coolant Microchannel Assembly With Manifold Member That Facilitates Coolant Line Attachment | Intel Corporation |
| 7302489 | Systems and Methods for Synchronizing Data Objects Among Participant Systems Via Asynchronous Exchange of Messages | SAP AG |
| 7278859 | Extended Package Substrate | Intel Corporation |
| 7277282 | Integrated Circuit Cooling System Including Heat Pipes and External Heat Sink | Intel Corporation |
| 7276396 | Die Handling System | Intel Corporation |
| 7272006 | Ic Coolant Microchannel Assembly With Integrated Attachment Hardware | Intel Corporation |
| 7262722 | Hardware-Based Cabac Decoder With Parallel Binary Arithmetic Decoding | Intel Corporation |
| 7259965 | Integrated Circuit Coolant Microchannel Assembly With Targeted Channel Configuration | Intel Corporation |
| 7243705 | Integrated Circuit Coolant Microchannel With Compliant Cover | Intel Corporation |
| 7236410 | Memory Cell Driver Circuits | Intel Corporation |
| 7219213 | Flag Bits Evaluation for Multiple Vector Simd Channels Execution | Intel Corporation |
| 7212408 | Multi-Slot Socket for Mounting Integrated Circuits on Circuit Board | Intel Corporation |
| 7209082 | Method and Apparatus for a Dual Band Gap Wideband Interference Suppression | Intel Corporation |
| 7209025 | Multi-Layer Inductor With Shielding Plane | Intel Corporation |
| 7199599 | Integrated Circuit Socket With Removable Support | Intel Corporation |
| 7197311 | Data Routing in a Universal Mobile Telecommunications System | Intel Corporation |
| 7196535 | Thermal Control System for Environmental Test Chamber | Intel Corporation |
| 7193316 | Integrated Circuit Coolant Microchannel With Movable Portion | Intel Corporation |
| 7188418 | Method of Making Split Fin Heat Sink | Intel Corporation |
| 7161908 | Deterministic Bandwidth Throttling to Facilitate Operation of a Control Unit | Intel Corporation |
| 7154157 | Stacked Semiconductor Radiation Sensors Having Color Component and Infrared Sensing Capability | Intel Corporation |
| 7152313 | Package Substrate for Integrated Circuit and Method of Making The Substrate | Intel Corporation |
| 7149995 | Graphical Interface to Layout Processing Components and Connections | Intel Corporation |
| 7148756 | Feedback System to Control Integrated Circuit Resonance | Intel Corporation |
| 7137626 | Packet Loss Recovery | Intel Corporation |
| 7121843 | Integrated Circuit Socket Corner Relief | Intel Corporation |
| 7100135 | Method and System to Evaluate Signal Line Spacing | Intel Corporation |
| 7098745 | System to Control Integrated Circuit Resonance | Intel Corporation |
| 7091737 | Apparatus and Methods for Self-Heating Burn-In Process | Intel Corporation |
| 7075180 | Method and Apparatus for Applying Body Bias to Integrated Circuit Die | Intel Corporation |
| 7061806 | Floating-Body Memory Cell Write | Intel Corporation |
| 7059045 | A Method for Handling Integrated Circuit Die | Intel Corporation |
| 7049526 | Microvia Structure and Fabrication | Intel Corporation |
| 7042727 | Heat Sink Mounting and Interface Mechanism and Method of Assembling Same | Intel Corporation |
| 7042077 | Integrated Circuit Package With Low Modulus Layer and Capacitor/Interposer | Intel Corporation |
| 7037458 | Progressive Stamping Apparatus and Method | Intel Corporation |
| 7001811 | Memory Cell Without Halo Implant | Intel Corporation |
| 6992339 | Asymmetric Memory Cell | Intel Corporation |
| 6982492 | No-Flow Underfill Composition and Method | Intel Corporation |
| 6979891 | Integrated Circuit Packaging Architecture | Intel Corporation |
| 6963996 | Session Error Recovery | Intel Corporation |
| 6903559 | Method and Apparatus to Determine Integrated Circuit Temperature | Intel Corporation |
| 6897556 | I/O Architecture for Integrated Circuit Package | Intel Corporation |
| 6879740 | Optical Space Switch | Denselight Semiconductor Pte Ltd |
| 6867124 | Integrated Circuit Packaging Design and Method | Intel Corporation |
| 6833606 | Fabrication of a Heterojunction Bipolar Transistor With Integrated Mim Capacitor | Denselight Semiconductor Pte Ltd |
| 6831871 | Stable Memory Cell Read | Intel Corporation |
| 6819853 | Fabrication of Stacked Photonic Lightwave Circuits | Denselight Semiconductor Pte Ltd |
| 6815977 | Scan Cell Systems and Methods | Intel Corporation |
| 6814500 | Optical Interface Utilising Polymer Assisted Strain Relief | Denselight Semiconductor Pte Ltd |
| 6813298 | A Current Blocking Structure to Improve Semiconductor Laser Performance | Denselight Semiconductor Pte Ltd |
| 6807215 | Two-Section Distributed Bragg Reflector Laser | Denselight Semiconductor Pte Ltd |
| 6798796 | Active Wavelength Locking | Denselight Semiconductor Pte Ltd |
| 6794760 | Integrated Circuit Interconnect | Intel Corporation |
| 6788118 | power Indication Circuit for a Processor | Intel Corporation |
| 6784722 | Wide-Range Local Bias Generator for Body Bias Grid | Intel Corporation |
| 6714415 | Split Fin Heat Sink | Intel Corporation |
| 6710642 | Bias Generation Circuit | Intel Corporation |
| 6650170 | Temperature Compensated Output Driver | Intel Corporation |